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  ? e96623-te sony reserves the right to change products and specifications without prior notice. this information does not convey any license by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustrating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. 1.7 to 2.0 ghz low noise amplifier/down conversion mixer CXG1013N ssop-16p-l01 (plastic) absolute maximum ratings (ta=25 ?) supply voltage v dd 6v operating temperature topr ?5 to +85 ? storage temperature tstg ?5 to +150 ? power dissipation p d 150 mw current consumption i dd (low noise amplifier) 20 ma i dd (lo amplifier) 10 ma i dd (mixer,if amplifier) 20 ma input power p in +5 dbm operating condition suppy voltage 3.0 v description the CXG1013N is a low noise amplifier/down conversion mixer mmic,designed using the sony's gaas j-fet process. features low noise nf=1.8 db (typ.) at 1.9 ghz (low noise amplifier) low distortion input ip3=?.5 dbm (typ.) at 1.9 ghz (mixer) low lo input power operation ?2 dbm single 3.0v power supply operation 16-pin ssop package applications japan digital cordless phone(phs) dect pcn pcs structure gaas j-fet mmic
? CXG1013N low noise amplifier mixer total symbol i dd g p nf iip3 i so i dd g c nf iip3 p lk i dd block diagram pin configuration lna mix lo amp if amp lna rf in lo in lna rf out mix rf in if out 16pin ssop (plastic) 116 lna rf in nc cap gnd gnd lo in cap v dd (lo amp) gnd gnd nc nc mix rf in cap if out/v dd (mix, if amp) lna rf out /v dd (lna) measurement condition when no signal when no signal when no signal electrical characteristics v dd =3.0 v, f rf =1.9 ghz, f lo =1.66 ghz, p lo =?2 dbm, when 50 k i/o matching; unless otherwise specified (ta=25 ?) min. typ. max. unit 2.5 3.5 ma 12.5 14.5 16.5 db 1.8 2.6 db ? ? dbm 25 30 db 5.5 8.0 ma 7 9 11 db 7.2 9.2 db ? ?.5 dbm ?9 ?4 dbm 8.0 10.0 ma item current consumption power gain noise figure input ip3 isolation current consumption conversion gain noise figure input ip3 lo to rf leak level current consumption
? CXG1013N recommended circuit c1 l2 c11 l1 l7 c3 l8 c14 l9 c7 1 2 3 4 5 6 7 8 lna rf in lo in v dd (lo amp) l3 c2 l5 c5 c6 r1 l4 c15 l10 c9 c4 9 10 11 12 13 14 15 16 lna rf out v dd (lna) mix rf in if out v dd (mix, if amp) l6 c13 c12 c8 c10 r2 l1 8.2 nh l10 68 nh c9 1000 pf l2 10 nh c1 100 pf c10 10 nf l3 2.2 nh c2 100 pf c11 100 pf l4 2.2 nh c3 100 pf c12 1000 pf l5 8.2 nh c4 7 pf c13 10 nf l6 22 nh c5 1000 pf c14 1000 pf l7 6.8 nh c6 10 nf c15 0.1 ? l8 3.3 nh c7 1000 pf r1 1 k l9 10 nh c8 10 nf r2 620
? CXG1013N back r2 c15 c14 gnd v dd (mix, if amp) v dd (lo amp) v dd (lna) glass fabric-base epoxy 4-layer board(2 0.3mm thickness) gnd for the 2nd and 3rd layers. recommended evaluation board front c13 c12 c11 l9 l8 l7 c3 c7 c8 c10 c9 c4 l10 l6 l5 gnd r1 l3 l4 c6 c5 l2 c1 l1 c2 v dd (lna) v dd (lo amp) v dd (mix, if amp) lo in lna rf in 50mm lna rf out mix rf in if out
? CXG1013N example of representative characteristics (ta=25 ?) 0 -10 -20 -30 -40 -90 -70 -50 -30 -10 10 5 -5 -15 -25 -35 -90 -70 -50 -30 -10 10 5 0 -5 -10 -15 -20 -25 0 2 4 6 8 10 5 7 9 11 13 15 5 0 -5 -10 -15 -20 -25 -6 -4 -2 0 2 4 -30 -25 -20 -15 -10 -5 lna block p out ,im3 vs . p in mix block p out ,im3 vs . p in mix block g c ,nf vs . p lo mix block iip3,p lk vs . p lo p out -rf output power (dbm) p in -rf input power (dbm) g c- conversion gain(db) nf-noise figure (db) p lo -lo input power (dbm) p lo -lo input power (dbm) iip3-input ip3 (dbm) p lk -lo to rf leak level (dbm) gc nf v dd =3.0v f rf =1.9ghz f lo =1.66ghz v dd =3.0v f rf =1.9ghz f lo =1.66ghz iip3 p lk v dd =3.0v f rf1 =1.9ghz f rf2 =1.9006ghz f lo =1.66ghz p lo =-12dbm v dd =3.0v f rf1 =1.9ghz f rf2 =1.9006ghz p out im3 p out im3 p out -if output power (dbm) p in -rf input power (dbm)
CXG1013N ? package outline unit : mm 16pin ssop (plastic) sony code eiaj code jedec code package structure package material lead treatment lead material package weight epoxy resin solder / palladium copper / 42 alloy 0.1g ssop-16p-l01 ssop016-p-0044 * 5.0 0.1 0.65 0.12 0.22 ?0.05 + 0.1 8 1 9 16 * 4.4 0.1 6.4 0.2 0.1 0.1 0.5 0.2 0?to 10 0.15 ?0.02 + 0.05 1.25 ?0.1 + 0.2 a detail a 0.1 plating note: dimension * ?does not include mold protrusion.


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